Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution

Scientific Article | Ici, l’accumulation des ions cuivreux dans une solution en une expérience de modèle et d’une analyse fondée sur des mesures
Knowledge of the behavior of cuprous ions (monovalent copper ion: Cu(I)) in a copper sulfate plating bath is important for improving the plating process.

Figure 6 from Analysis of Cu(I) in Copper Sulfate Electroplating Solution

Molecular Microbiology, Microbiology Journal

Increase of current density by electrolysis for 0 to 10 min.

Acid copper sulphate plating problems: black anodes, excess copper. Anodes passivating?

Copper Electroplating: How It Works and Its Applications

Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution

Metals, Free Full-Text

Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution

Reaction curve of Cu(I) and BCS in electrolysis solutions (at 62.5 mA/

1-(4-Hydroxyphenyl)-2 H -tetrazole-5-thione as a leveler for acid copper electroplating of microvia - RSC Advances (RSC Publishing) DOI:10.1039/D2RA02274E